dual color led lamps pb lead-free parts ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905-lxg3390/r1-pf rev. : a date : 13 - jun. - 2006 data sheet lxg3390/r1-pf
directivity radiation 0 60 30 75%100% 25% 25%0 50% -60 -30 75% 100% 50% 7.6 8.6 10.5 0.5 5.0 5.9 1.5max 2.0min 2.54typ 2.54typ 0.5 typ 2.0min 1 2 3 18.0min part no. lxg3390/r1-pf package dimensions page 1/5 ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.cathode green 2.common anode 3. - + 2 13 g
ligitek electronics co.,ltd. property of ligitek only peak 565 wave length nm note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 typical electrical & optical characteristics (ta=25 ) operating temperature t opr p lxg3390/r1-pf gap green emitted green diffused lens part no material color storage temperature tstg forward current i f power dissipation peak forward current duty 1/10@10khz reverse current @5v ir pd i fp parameter symbol -40 ~ +85 viewing angle 2 1/2 (deg) max. 301.72.6 min. 1.84.576 typ. min. forward voltage @20ma(v) spectral halfwidth nm luminous intensity @ ma(mcd) 10 -40 ~ +100 page2/5 30 ma 10 a 100 120 mw ma ratings g unit part no. lxg3390/r1-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 3/5 part no. lxg3390/r1-pf
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max part no. lxg3390/r1-pf
page 5/5 ligitek electronics co.,ltd. property of ligitek only reliability test: mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item description reference standard mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. part no. lxg3390/r1-pf
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